Semiconductor device, thin film transistor substrate, and display apparatus

ABSTRACT

A semiconductor device (S T ) includes a substrate ( 11 ), a gate electrode ( 12   b ), a gate insulating film ( 13   b ), an oxide semiconductor film ( 14   b ) including a channel part ( 14   bc ) formed in a position facing the gate electrode ( 12   b ), a source electrode ( 15   bs ), and a drain electrode ( 15   bd ). The source electrode ( 15   bs ) and the drain electrode ( 15   bd ) is arranged so as not to overlap with the gate electrode ( 12   b ) as viewed in the plane. A region adjacent to the gate electrode ( 12   b ) and the source electrode ( 15   bs ) and a region adjacent to the gate electrode ( 12   b ) and the drain electrode ( 15   bd ) are, in a region where the source electrode ( 15   bs ) and the drain electrode ( 15   bd ) does not overlap with the gate electrode ( 12   b ), processed such that resistance in a region of the oxide semiconductor film ( 14   b ) including a surface thereof is reduced.

TECHNICAL FIELD

The present invention relates to a semiconductor device including an oxide semiconductor film. In addition, the present invention relates to a thin film transistor substrate including the semiconductor device and to a display apparatus.

As an active matrix substrate, a thin film transistor substrate (hereinafter also referred to as a “TFT substrate”) in which a thin film transistor (hereinafter also referred to as a “TFT”) is, as a switching element, provided for each pixel which is the minimum unit of an image has been broadly used.

A TFT having a typical configuration includes, e.g., a gate electrode provided on an insulating substrate, a gate insulating film provided so as to cover the gate electrode, a semiconductor layer provided on the gate insulating film so as to have an island shape and overlap with the gate electrode, and a source electrode and a drain electrode provided so as to face each other on the semiconductor layer. As the semiconductor layer, a layer made of an amorphous silicon semiconductor film is typically used (see, e.g., Patent Document 1).

A TFT substrate is manufactured by forming pixel electrodes on a polarized film. In addition, a liquid crystal display apparatus is manufactured by providing a counter substrate so as to face the TFT substrate and providing a liquid crystal layer between the TFT substrate and the counter substrate.

Patent Document

PATENT DOCUMENT 1: Japanese Patent Publication No. 2005-302808

SUMMARY OF THE INVENTION Technical Problem

In recent years, a TFT using a semiconductor film (hereinafter also referred to as an “oxide semiconductor film”) made of an oxide semiconductor has been, as a TFT for each pixel which is the minimum unit of an image, proposed for a TFT substrate instead of a TFT using a semiconductor film made of amorphous silicon (a-Si). The oxide semiconductor film has the following advantages over the a-Si semiconductor film: the oxide semiconductor film has high electron mobility; a low-temperature process is available for the oxide semiconductor film; and the oxide semiconductor film has small property fluctuation of the TFT caused due to electric stress. Particular attention has been drawn to the TFT using the oxide semiconductor film for formation of a small driver circuit area because such a TFT has the high electron mobility and the small property fluctuation caused due to the electric stress.

In addition, in recent years, there has been a great need for size reduction of a display apparatus mounted in mobile equipment, and study and development have been actively made on a monolithic display apparatus for which a retrofitted driver chip is not necessary because of simultaneous formation of the TFTs and a driver circuit in the display apparatus. Since the small driver circuit area can be formed, the oxide semiconductor TFT is preferable as a TFT used for the monolithic display apparatus. It has been expected that the oxide semiconductor TFT is applied to the monolithic display apparatus.

Typically, a bottom-gate structure manufactured at low cost is employed for a TFT of a display apparatus. In the bottom-gate structure, a gate electrode and a source electrode partially overlap with each other, and the gate electrode and a drain electrode partially overlap with each other. If a driver circuit is formed by the TFTs having such a structure, parasitic capacitance is generated at the foregoing overlap parts. Thus, it is necessary that the channel width of the thin film transistor is increased in order to reduce the parasitic capacitance (see FIG. 18). Particularly a thin film transistor forming the last stage of a buffer circuit of a gate driver is intended for current larger than that of a thin film transistor in a pixel region. Thus, the channel width of the TFT should be significantly increased. Under present circumstances, the thin film transistor forming the last stage of the buffer circuit of the gate driver is formed so as to have, e.g., a channel width of about 800 nm.

The present inventors have found that the thin film transistor using the oxide semiconductor film has a property that an increase in channel width W results in higher probability of occurrence of short-circuit in the TFT (see FIG. 19). That is, the increase in channel width of the thin film transistor using the oxide semiconductor film results in reduction in yield rate of the TFT.

The present invention has been made in view of the foregoing, and it is an objective of the present invention to provide, with a good yield rate, a semiconductor device including an oxide semiconductor film, a thin film transistor substrate including the semiconductor device, and a display apparatus.

Solution to the Problem

In order to accomplish the foregoing objective, a first aspect of the present invention is intended for a semiconductor device including a substrate; a gate electrode provided on the substrate; a gate insulating film provided so as to cover the gate electrode; an oxide semiconductor film provided on the gate insulating film and including a channel part formed in a position facing the gate electrode; and a source electrode and a drain electrode provided apart from each other on the oxide semiconductor film with the channel part being interposed between the source electrode and the drain electrode. At least one of the source electrode and the drain electrode is arranged so as not to overlap with the gate electrode as viewed in plane, and a region adjacent to the gate electrode and the source electrode and a region adjacent to the gate electrode and the drain electrode are, in a region where the at least one of the source electrode and the drain electrode does not overlap with the gate electrode, processed for resistance reduction in a region of the oxide semiconductor film including a surface thereof.

According to the foregoing configuration, the gate electrode and the source electrode do not overlap with each other, or the gate electrode and the drain electrode do not overlap with each other. Thus, parasitic capacitance C_(gs) generated between the gate electrode and the source electrode or parasitic capacitance C_(gd) generated between the gate electrode and the drain electrode can be reduced. Even if the gate electrode and the source electrode do not overlap with each other, or the gate electrode and the drain electrode do not overlap with each other, the region adjacent to the gate electrode and the source electrode and the region adjacent to the gate electrode and the drain electrode are processed such that the resistance thereof is reduced. Thus, the parasitic capacitance C_(gs), C_(gd) can be reduced without reducing on-state current of the thin film transistor. The parasitic capacitance generated between the gate electrode and the source electrode and/or between the gate electrode and the drain electrode is reduced, thereby reducing the channel width of the semiconductor device. Due to the reduction in channel width of the semiconductor device including the oxide semiconductor film, short-circuit of the semiconductor device is less likely to occur, and, as a result, a good yield rate can be obtained.

A second aspect of the invention is intended for the semiconductor device of the first aspect of the invention, in which sheet resistance in the region of the oxide semiconductor film where the resistance is reduced is 10 Ω/sq-100 kΩ/sq.

According to the foregoing configuration, even if the gate electrode and the source electrode do not overlap with each other, and/or the gate electrode and the drain electrode do not overlap with each other, the region adjacent to the gate electrode and the source electrode and the region adjacent to the gate electrode and the drain electrode are processed such that the resistance thereof is reduced, and therefore the sheet resistance is 10 Ω/sq-100 kΩ/sq. Thus, on-state current of the semiconductor device is not reduced.

A third aspect of the invention is intended for the semiconductor device of the first or second aspect of the invention, in which the channel part has a channel width of equal to or less than 50 μm.

According to the foregoing configuration, since the channel width of the semiconductor device is equal to or less than 50 μm, the short-circuit of the semiconductor device is less likely to occur. Thus, the good yield rate of the semiconductor device can be obtained.

A fourth aspect of the invention is intended for the semiconductor device of any one of the first to third aspects of the invention, in which the oxide semiconductor film is made of metal oxide containing at least one selected from a group consisting of indium (In), gallium (Ga), and zinc (Zn).

According to the foregoing configuration, although the oxide semiconductor layer made of the foregoing material is amorphous, the mobility thereof is high. Thus, on-state resistance of the semiconductor device can be increased.

A fifth aspect of the invention is intended for the semiconductor device of the fourth aspect of the invention, in which the oxide semiconductor film is made of In—Ga—Zn—O metal oxide.

According to the foregoing configuration, good properties of the TFT such as high mobility and low off-state current can be obtained.

Since the semiconductor device of any one of the first to fifth aspects of the invention has the small channel width, the short-circuit is less likely to occur, and the good yield rate can be obtained. Thus, if the semiconductor device of any one of the first to fifth aspects of the invention is a thin film transistor as in a sixth aspect of the invention, the semiconductor device can be suitably used for a thin film transistor substrate including the thin film transistor on a substrate body.

The thin film transistor substrate of the sixth aspect of the invention includes the semiconductor device in which the gate electrode and the source electrode do not overlap with each other and/or the gate electrode and the drain electrode do no overlap with each other. The parasitic capacitance generated between the gate electrode and the source electrode and between the gate electrode and the drain electrode is reduced, thereby reducing the channel width. Thus, the short-circuit of the semiconductor device is less likely to occur, and the good yield rate can be obtained. Consequently, the thin film transistor substrate can be suitably used for the semiconductor device which conventionally requires a great channel width if the semiconductor device of any one of the first to fifth aspects of the invention is, as in a seventh aspect of the invention, provided at the last stage of a buffer circuit of a gate driver region and is intended for large current.

The thin film transistor substrate of the sixth or seventh aspect of the invention includes the semiconductor device having the channel width reduced by the reduction in parasitic capacitance generated between the gate electrode and the source electrode and/or between the gate electrode and the drain electrode. Thus, the thin film transistor substrate has excellent properties such as a good yield rate. Consequently, the thin film transistor substrate of the present invention can be suitably used for a display apparatus which, as in an eighth aspect of the invention, includes the thin film transistor substrate of the sixth or seventh aspect of the invention; a counter substrate arranged so as to face the thin film transistor substrate; and a display medium layer provided between the thin film transistor substrate and the counter substrate.

The display apparatus of the present invention can be suitably used for the display apparatus in which the display medium layer is a liquid crystal layer as in a ninth aspect of the invention.

Advantages of the Invention

According to the present invention, the gate electrode and the source electrode do not overlap with each other, or the gate electrode and the drain electrode do not overlap with each other. Thus, the parasitic capacitance C_(gs) generated between the gate electrode and the source electrode or the parasitic capacitance C_(gd) generated between the gate electrode and the drain electrode can be reduced. Even if the gate electrode and the source electrode do not overlap with each other, or the gate electrode and the drain electrode do not overlap with each other, the region adjacent to the gate electrode and the source electrode and the region adjacent to the gate electrode and the drain electrode are processed such that the resistance thereof is reduced. Thus, the parasitic capacitance C_(gs), C_(gd) can be reduced without reducing on-state current of the thin film transistor. The parasitic capacitance generated between the gate electrode and the source electrode and/or between the gate electrode and the drain electrode is reduced, thereby reducing the channel width of the semiconductor device. Due to the reduction in channel width of the semiconductor device including the oxide semiconductor film, the short-circuit of the semiconductor device is less likely to occur, and, as a result, the good yield rate can be obtained.

As described above, the good yield rate can be obtained for the semiconductor device including the oxide semiconductor film, and can be also obtained for the thin film transistor substrate including the semiconductor film and for the display apparatus.

BRIEF DESCRIPTION OF THE DRAWINGS

[FIG. 1] FIG. 1 is a plan view of a liquid crystal display apparatus of an embodiment.

[FIG. 2] FIG. 2 is a cross-sectional view along an II-II line illustrated in FIG. 1.

[FIG. 3] FIG. 3 is a schematic diagram illustrating an electronic circuit of the liquid crystal display apparatus of the embodiment.

[FIG. 4] FIG. 4 is an enlarged plan view illustrating a main part of the liquid crystal display apparatus of the embodiment.

[FIG. 5] FIG. 5 is a cross-sectional view of a thin film transistor of the embodiment along a B-B line illustrated in FIG. 4.

[FIG. 6] FIGS. 6( a) and 6(b) are views illustrating steps for manufacturing a TFT, and each illustrate cross sections along an A-A line, the B-B line, a C-C line, and a D-D line illustrated in FIG. 4.

[FIG. 7] FIGS. 7( a) and 7(b) are views illustrating steps for manufacturing the TFT, and each illustrate the cross sections along the A-A line, the B-B line, the C-C line, and the D-D line illustrated in FIG. 4.

[FIG. 8] FIGS. 8( a) and 8(b) are views illustrating steps for manufacturing the TFT, and each illustrate the cross sections along the A-A line, the B-B line, the C-C line, and the D-D line illustrated in FIG. 4.

[FIG. 9] FIG. 9 is a cross-sectional view illustrating a variation of an auxiliary capacitive device.

[FIG. 10] FIG. 10 is a cross-sectional view illustrating a variation of the thin film transistor of the embodiment.

[FIG. 11] FIGS. 11( a) and 11(b) are plan views illustrating a channel length L in the thin film transistor.

[FIG. 12] FIGS. 12( a) and 12(b) are cross-sectional views illustrating the channel length L in the thin film transistor.

[FIG. 13] FIG. 13 is a cross-sectional view illustrating a variation of the thin film transistor of the embodiment.

[FIG. 14] FIG. 14 is a cross-sectional view illustrating a variation of the thin film transistor provided in a pixel region.

[FIG. 15] FIG. 15 is a cross-sectional view illustrating a variation of the thin film transistor of the embodiment.

[FIG. 16] FIG. 16 is a cross-sectional view illustrating a variation of the thin film transistor of the embodiment.

[FIG. 17] FIG. 17 is a plan view illustrating a variation of the thin film transistor of the embodiment.

[FIG. 18] FIG. 18 is a graph illustrating a relationship between a channel width W and parasitic capacitance C_(gs), C_(gd) in the thin film transistor provided in a buffer circuit of a gate driver region.

[FIG. 19] FIG. 19 is a graph illustrating a relationship between the channel width W and the probability of occurrence of short-circuit of the TFT in the thin film transistor provided in the buffer circuit of the gate driver region.

DESCRIPTION OF EMBODIMENTS

An embodiment of the present invention will be described below in detail with reference to drawings. Note that the present invention is not limited to the embodiment described below.

(Configuration of Liquid Crystal Display Apparatus)

FIG. 1 is a plan view illustrating a liquid crystal display apparatus 1 which includes a TFT substrate 10 having thin film transistors S_(T) in the present embodiment, and FIG. 2 is a cross-sectional view along an II-II line illustrated in FIG. 1. In addition, FIG. 3 is an enlarged schematic electronic circuit diagram illustrating a display region D and a gate driver region Tg of the TFT substrate 10 including the thin film transistors in the present embodiment. FIG. 4 is an enlarged plan view illustrating the display region D and the gate driver region Tg of the TFT substrate 10 including the thin film transistors S_(T) in the present embodiment, and FIG. 5 is a cross-sectional view of the thin film transistor of the present embodiment along a B-B line illustrated in FIG. 4.

In the liquid crystal display apparatus 1, the TFT substrate 10 and a counter substrate 20 are arranged so as to face each other, and are bonded together by a sealing material 40 provided in an outer peripheral part of the substrate. In a region surrounded by the sealing material 40, a liquid crystal layer 30 is provided as a display medium layer.

In the liquid crystal display apparatus 1, the display region D where an image is displayed is formed in part of the liquid crystal display apparatus 1 on an inner side relative to the sealing material 40, and a terminal region T (i.e., the gate driver region Tg and a source driver region Ts) is formed in part of the TFT substrate 10 protruding beyond the counter substrate 20.

Referring to FIG. 3, the TFT substrate 10 includes, in the display region D, a plurality of scanning lines 121 provided so as to extend parallel to each other, a plurality of signal lines 151 provided so as to extend parallel to a direction perpendicular to each of the scanning lines 121, and a plurality of thin film transistors S_(p) each provided at each pixel, i.e., at an intersection between the scanning line 121 and the signal line 151. In addition, a plurality of auxiliary capacitive lines (first conductive films) 12 c extending parallel to each other are provided between adjacent ones of the scanning lines 121 (not shown in FIG. 3, and see FIG. 4). In the gate driver region Tg of the TFT substrate 10, a buffer circuit configured to apply current to each of the scanning lines 121 is formed, and the thin film transistor S_(T) including the configuration of the present embodiment is provided at the last stage of the buffer circuit.

The TFT substrate 10 has a multi-layer structure, i.e., a structure in which the followings are stacked each other on a substrate 11: first conductive films 12 a-12 d; first insulating films 13 a-13 d; oxide semiconductor films 14 b, 14 d; second conductive films 15 a-15 d; passivation films 17 a-17 d; polarized films 18 a-18 d; and third conductive films 19 a, 19 c, 19 d.

Referring to FIG. 5, in the thin film transistor S_(T), the first conductive film 12 b is provided as a gate electrode, and the oxide semiconductor film 14 b is provided above the gate electrode 12 b through the gate insulating film 13 b provided so as to cover the gate electrode 12 b. Note that a channel part 14 bc is formed at a position of the oxide semiconductor film 14 b facing the gate electrode 12 b. A source electrode 15 bs and a drain electrode 15 bd formed from the second conductive film 15 b are provided above the oxide semiconductor film 14 b in the state in which the source electrode 15 bs and the drain electrode 15 bd are apart from each other so as to sandwich the channel part 14 bc. The passivation film 17 b and the polarized film 18 b are stacked so as to cover the foregoing.

The gate electrode 12 b, the gate insulating film 13 b, the source electrode 15 bs, the drain electrode 15 bd, the passivation film 17 b, and the polarized film 18 b are each made of a publicly-known material.

The oxide semiconductor film 14 b is made of, e.g., In—Ga—Zn—O (IGZO) metal oxide, and has a thickness of, e.g., about 10-200 nm. Although the IGZO metal oxide is amorphous, the mobility thereof is high. Thus, good properties of the thin film transistor S_(T) such as high mobility and low off-state current can be obtained. Although it has been described that the oxide semiconductor film 14 b is made of the IGZO metal oxide, the oxide semiconductor film 14 b may be made of, e.g., metal oxide containing any one of In, Ga, and Zn. Although such metal oxide is amorphous, the mobility thereof is high. Thus, the thin film transistor S_(T) having high on-state current can be formed.

The thin film transistor S_(T) is formed such that the source electrode 15 bs and the gate electrode 12 b do not overlap with each other as viewed in the plane, and that the drain electrode 15 bd and the gate electrode 12 b do not overlap with each other as viewed in the plane. A region 14 bbs of the oxide semiconductor film 14 b adjacent to both of the gate electrode 12 b and the source electrode 15 bs, and a region 14 bbd of the oxide semiconductor film 14 b adjacent to both of the gate electrode 12 b and the drain electrode 15 bd are processed such that the resistance thereof is reduced. The sheet resistance in each of the regions 14 bbs, 14 bbd is about 10 Ω/sq-100 kΩ/sq. Each of the regions 14 bbs, 14 bbd having the reduced resistance is formed so as to have a width of, e.g., about 5-300 μm. In the processing for reducing the resistance of the oxide semiconductor film 14 b, the resistance in at least part of the oxide semiconductor film 14 b including a surface thereof may be reduced. The part having the reduced resistance may, as an example, have a thickness of about 2-20 nm, or may have another thickness.

A region of the oxide semiconductor film 14 b between the regions 14 bbs, 14 bbd having the reduced resistance forms the channel part 14 bc. The channel part 14 bc is formed in, e.g., a rectangular shape. The channel width W is about 5-300 μm, and the channel length L is about 2-20 μm (see FIG. 11( b)).

In the thin film transistor S_(T), the gate electrode 12 b and the source electrode 15 bs do not overlap with each other, or the gate electrode 12 b and the drain electrode 15 bd do not overlap with each other. Thus, parasitic capacitance C_(gs) generated between the gate electrode 12 b and the source electrode 15 bs or parasitic capacitance C_(gd) generated between the gate electrode 12 b and the drain electrode 15 bd can be reduced. Even if the gate electrode 12 b and the source electrode 15 bs do not overlap with each other, or the gate electrode 12 b and the drain electrode 15 bd do not overlap with each other, the region 14 bbs of the oxide semiconductor film 14 b adjacent to both of the gate electrode 12 b and the source electrode 15 bs or the region 14 bbd of the oxide semiconductor film 14 b adjacent to both of the gate electrode 12 b and the drain electrode 15 bd is processed such that the resistance thereof is reduced, and therefore the parasitic capacitance C_(gs), C_(gd) can be reduced without reducing on-state current of the thin film transistor S_(T).

Each of components (e.g., auxiliary capacitive devices C_(S), the thin film transistors S_(P) formed in the display region D, and gate-source contact parts GS) other than the thin film transistors S_(T) formed in the terminal region T has the similar structure to that of a publicly-known TFT substrate, i.e., has the multi-layer structure of the first conductive film 12 a, 12 c, 12 d, the first insulating film 13 a, 13 c, 13 d, the oxide semiconductor film 14 d, the second conductive film 15 a, 15 c, 15 d, the passivation film 17 a, 17 c, 17 d, the polarized film 18 a, 18 c, 18 d, and the third conductive film 19 a, 19 c, 19 d (see FIG. 8( b)).

A color filter layer including, on a substrate, a light shielding layer and a colored layer is provided on the counter substrate 20, and a common electrode is provided so as to cover the color filter layer. In addition, an alignment film is provided so as to cover the common electrode.

The liquid crystal layer 30 is made of, e.g., a nematic liquid crystal material having electrooptic properties.

In the liquid crystal display apparatus 1 having the foregoing configuration, a gate signal(s) is, at each pixel, transmitted from the gate driver to the gate electrode 12 b through the scanning line 121. When the thin film transistor S_(P) of the display region D is turned on, a source signal(s) is, at the thin film transistor S_(P), transmitted from the source driver to a source electrode 15 ds through the signal line 15I, and then a predetermined charge is written to the pixel electrode 19 d through the oxide semiconductor film 14 d and a drain electrode 15 dd. At this point, a potential difference between each of the pixel electrodes 19 d of the TFT substrate 10 and the common electrode of the counter substrate 20 is generated, and predetermined voltage is applied to the liquid crystal layer 30, i.e., liquid crystal capacitance for each pixel, and to the auxiliary capacitive device C_(S) connected to the liquid crystal capacitance in parallel. Then, in the liquid crystal display apparatus 1, an alignment state of the liquid crystal layer 30 is, at each pixel, changed depending on the magnitude of voltage applied to the liquid crystal layer 30. In such a manner, a light transmittance of the liquid crystal layer 30 is adjusted, thereby displaying an image.

(Method for Manufacturing TFT Substrate)

A method for manufacturing the TFT substrate 10 of the present embodiment will be described below with reference to FIGS. 6-8.

First, e.g., the followings are stacked each other to form a first conductive film: a Ti film having a thickness of about 30 nm; an Al film having a thickness of about 200 nm; and a Ti film having a thickness of about 100 nm. Such a film is patterned corresponding to gate-source contact parts GS, thin film transistors S_(T) of a gate driver region Tg, auxiliary capacitive devices C_(S), thin film transistors S_(P) of a display region D. Referring to FIG. 6( a), a SiN film having a thickness of about 325 nm and a SiO₂ film having a thickness of about 50 nm are stacked on the first conductive films 12 a-12 d which have been patterned, and then first insulating films 13 a-13 d are formed.

Subsequently, e.g., an oxide semiconductor film having a thickness of about 40 nm is formed. Referring to FIG. 6( b), such a film is patterned corresponding to the thin film transistors S_(T) of the gate driver region Tg and the thin film transistors Sp of the display region D. The sheet resistance of the formed oxide semiconductor films 14 b, 14 d is, e.g., about 1×10¹²−1×10¹⁷ Ω/sq.

Note that the oxide semiconductor film may be, referring to FIG. 9, patterned so as to cover the auxiliary capacitive devices C_(S).

Next, e.g., the followings are stacked each other to form a second conductive film: a Ti film having a thickness of about 30 nm; an Al film having a thickness of about 200 nm; and a Ti film having a thickness of about 100 nm. Then, such a film is patterned. At this point, referring to FIG. 7( b), the second conductive film is patterned such that an end part of the second conductive film 15 a is, at each of the gate-source contact parts GS, positioned above the first conductive film 12 a with the first insulating film 13 a being interposed between the second conductive film 15 a and the first conductive film 12 a. In each of the thin film transistors S_(T) of the gate driver region Tg, a source electrode 15 bs and a drain electrode 15 bd are formed so as not to overlap with the first conductive film 12 b. In each of the auxiliary capacitive devices C_(S), the second conductive film 15 c is provided so as to cover the auxiliary capacitive device C_(S). In each of the thin film transistors S_(P) of the display region D, the second conductive film 15 d is patterned such that a source electrode 15 ds and a drain electrode 15 dd are formed in the state in which part of the oxide semiconductor film 14 d which will be a channel part 14 dc remains above the first conductive film 12 d.

At this point, in each of the thin film transistor S_(T) of the gate driver region Tg, the gate electrode 12 b and the drain electrode 15 bd may be, referring to FIG. 10, provided so as not to overlap with each other as viewed in the plane, and the gate electrode 12 b and the source electrode 15 bs may be provided so as to partially overlap with each other as viewed in the plane. In such a case, parasitic capacitance C_(gd) between the gate electrode 12 b and the drain electrode 15 bd is reduced, and therefore a channel width W can be reduced by the foregoing reduction amount. Conversely, the gate electrode 12 b and the source electrode 15 bs may be provided so as not to overlap with each other as viewed in the plane, and the gate electrode 12 b and the drain electrode 15 bd may be provided so as to partially overlap with each other as viewed in the plane.

Next, referring to FIG. 7( b), a resist film is applied to a thickness of 1-2 μm, and then is exposed to light and is developed to form resists 16 a-16 d. Note that the resist film is exposed to light from a side closer to the substrate (i.e., a side opposite to the resist film), and the resists 16 a-16 d are formed only on the first conductive film 12 and the second conductive film 15. At this point, a light exposure time is adjusted in order to form the resist 16 b corresponding to the channel part 14 bc on an inner side in part of the gate driver region Tg where each of the thin film transistors S_(T) is formed.

Since the resist film is exposed to light from the side closer to the substrate to form the resists 16 a-16 d, the resist 16 b defining the channel part 14 bc has a width smaller than that of the gate electrode 12 b. Thus, since the channel part 14 bc is formed such that the width of the gate electrode is, referring to FIGS. 11( b) and 12(b), equal to a dimension M of a mask, a channel length L of the channel part 14 bc is smaller than the dimension M of the mask as compared to the case where a channel length L of a channel part 114 c is, referring to FIGS. 11( a) and 12(a), specified by patterning using a mask (i.e., the case where a dimension M of the mask is equal to the channel length L). Thus, on-state current of the thin film transistor S_(T) is increased, thereby realizing higher-speed driving.

Subsequently, referring to FIG. 8( a), annealing under hydrogen atmosphere or hydrogen plasma processing is performed, thereby processing a region of the oxide semiconductor films 14 b, 14 d which is not covered by the resists 16 b, 16 d to reduce the resistance of such a region. Thus, in each of the thin film transistors S_(T) of the gate driver region Tg, sheet resistance in the region of the oxide semiconductor film 14 b which is not covered by the resist 16 b or the second conductive film 15 b is, e.g., 10 Ω/sq-100 kΩ/sq. After the processing for reducing the resistance, the resists 16 a-16 d are removed.

Subsequently, referring to FIG. 8( b), e.g., a SiO₂ film having a thickness of about 265 nm is formed on the entirety of a substrate 11 as passivation films 17 a-17 d, and, e.g., a photosensitive resin film is formed on the entirety of the substrate 11 as polarized films 18 a-18 d. Then, in each of the gate-source contact parts GS, a contact hole Ca through which both of the first conductive film 12 a and the second conductive film 15 a are exposed is formed. In addition, in each of the auxiliary capacitive devices C_(S), a contact hole Cc extending from the polarized film 18 c to the second conductive film 15 c is formed. Then, e.g., an ITO film having a thickness of about 100 nm is formed as third conductive films 19 a, 19 c, 19 d. Such a film is patterned such that a surface of the contact hole Ca is covered in each of the gate-source contact parts GS, and that a pixel electrode 19 d (19 c) including the thin film transistor S_(P) of the display region D and the auxiliary capacitive device C_(S) is formed.

Finally, an alignment film is formed so as to cover the display region D, and a TFT substrate 10 is manufactured.

A liquid crystal display apparatus 1 can be formed by, e.g., bonding the TFT substrate 10 to a counter substrate 20 additionally formed by a publicly-known method with a sealing material 40 being interposed between the TFT substrate 10 and the counter substrate 20 and by providing a liquid crystal layer 30 between the TFT substrate 10 and the counter substrate 20.

Note that, in each of the thin film transistors S_(T) and S_(P), a second insulating film 50 b, 50 d may be formed between the oxide semiconductor film 14 b, 14 d and the second conductive film 15 b, 15 d so as to cover the channel part 14 bc, 14 dc.

Referring to FIG. 13, if the second insulating film 50 b is provided so as to cover the channel part 14 bc of the thin film transistor S_(T) of the gate driver region Tg, the channel part 14 bc of the oxide semiconductor film 14 b can be covered by the second insulating film 50 b right after formation of the oxide semiconductor film 14 b. Thus, the channel part 14 bc is less likely to be susceptible to electric stress or temperature stress caused due to external factors, and therefore operation properties of the TFT are enhanced.

Referring to FIG. 14, if the second insulating film 50 d is provided so as to cover the channel part 14 dc of the thin film transistor Sp of the display region D, the source electrode 15 ds and the channel part 14 dc are provided so as to partially overlap with each other, or the drain electrode 15 dd and the channel part 14 dc are provided so as to partially overlap with each other. Thus, an effective channel length La is reduced by the overlap part, and on-state current of the thin film transistor S_(P) is increased. Consequently, higher-speed driving can be realized.

It has been described that the processing for reducing the resistance of the oxide semiconductor film 14 b is performed after the patterning of the second conductive film. However, the processing for reducing the resistance may be performed after the formation of the oxide semiconductor film and before the patterning of the oxide semiconductor film, or the processing for reducing the resistance of the oxide semiconductor film 14 b may be performed after the formation of the oxide semiconductor film.

Referring to FIG. 15, if the processing for reducing the resistance of the oxide semiconductor film 14 b is performed before the second conductive film 15 b is provided, the sheet resistance in a region 14 bt of the oxide semiconductor film 14 b covered by second conductive films 15 bs, 15 bd is reduced. Thus, contact resistance between the oxide semiconductor film 14 b and each of the second conductive films 15 bs, 15 bd is reduced, and on-state current of the thin film transistor S_(T) is increased. Consequently, the higher-speed driving can be realized. Such a thin film transistor S_(T) can be more preferably used by a peripheral drive circuit. If the resistance in only a surface part 14 bu of the oxide semiconductor film 14 b is reduced referring to FIG. 16, there is a possibility that the low-resistance surface part 14 bu of the oxide semiconductor film 14 b is etched when the second conductive films 15 bs, 15 bd are patterned and only part 14 b 1 which is below the surface part 14 bu and which is not processed such that the resistance thereof is reduced remains. Thus, if the processing for reducing the resistance of the oxide semiconductor film 14 b is performed before the second conductive films 15 bs, 15 bd are provided, it is necessary to perform controls relating to, e.g., the thickness of the oxide semiconductor film 14 b for which the processing for reducing the resistance is performed and the etching depth.

A plurality of channel parts 14 bc may be provided on a single oxide semiconductor film 14 b. In such a case, referring to, e.g., FIG. 17, a layout may be employed, in which two source electrodes 15 bs are provided so as to sandwich two channel parts 14 bc which are positioned so as to face each other and a drain electrode 15 bd is provided at each of end parts of the channel parts 14 bc. At this point, a region 14 bbs of the oxide semiconductor film 14 b between the source electrode 15 bs and the gate electrode 12 b and a region 14 bbd of the oxide semiconductor film 14 b between the drain electrode 15 bd and the gate electrode 12 b are processed such that the resistance thereof is reduced.

It has been described that the thin film transistor S_(T) of the present invention is provided at the last stage of the gate driver region Tg. However, the thin film transistor S_(T) of the present invention may be formed at part other than the last stage of the gate driver region Tg, or may be formed corresponding to each pixel of the display region D.

According to the foregoing embodiment, the gate electrode 12 b and the source electrode 15 bs does not overlap with each other, or the gate electrode 12 b and the drain electrode 15 bd do not overlap with each other. Thus, the parasitic capacitance C_(gs) generated between the gate electrode 12 b and the source electrode 15 bs or the parasitic capacitance C_(gd) generated between the gate electrode 12 b and the drain electrode 15 bd can be reduced. Even if the gate electrode 12 b and the source electrode 15 bs do not overlap with each other, or the gate electrode 12 b and the drain electrode 15 bd do not overlap with each other, the region 14 bbs of the oxide semiconductor film 14 b adjacent to both of the gate electrode 12 b and the source electrode 15 bs or the region 14 bbd of the oxide semiconductor film 14 b adjacent to both of the gate electrode 12 b and the drain electrode 15 bd are processed such that the resistance thereof is reduced. Thus, the parasitic capacitance C_(gs), C_(gd) can be reduced without reducing on-state current of the thin film transistor. Consequently, the parasitic capacitance C_(gs), C_(gd) generated between the gate electrode 12 b and the source electrode 15 bs and/or between the gate electrode 12 b and the drain electrode 15 bd is reduced, thereby reducing the channel width W of the thin film transistor S_(T). Due to the small channel width W of the thin film transistor S_(T) including the oxide semiconductor film 14 b, short-circuit of the thin film transistor S_(T) is less likely to occur, and, as a result, a good yield rate can be obtained.

INDUSTRIAL APPLICABILITY

The present invention is useful for the semiconductor device including the oxide semiconductor film, the thin film transistor substrate including the semiconductor device, and the display apparatus.

DESCRIPTION OF REFERENCE CHARACTERS

1 Liquid Crystal Display Apparatus

Tg Gate Driver Region

S_(T) Semiconductor Device (Thin Film Transistor)

W Channel Width

10 TFT Substrate

11 Substrate

12 b Gate Electrode (First Conductive Film)

13 b Gate Insulating Film (First Insulating Film)

14 b Oxide Semiconductor Film

14 b, 14 d Oxide Semiconductor Film

14 bc Channel Part

15 bd Drain Electrode (Second Conductive Film)

15 bs Source Electrode (Second Conductive Film)

20 Counter Substrate

30 Liquid Crystal Layer 

1. A semiconductor device, comprising: a substrate; a gate electrode provided on the substrate; a gate insulating film provided so as to cover the gate electrode; an oxide semiconductor film provided on the gate insulating film and including a channel part formed in a position facing the gate electrode; and a source electrode and a drain electrode provided apart from each other on the oxide semiconductor film with the channel part being interposed between the source electrode and the drain electrode, wherein at least one of the source electrode and the drain electrode is arranged so as not to overlap with the gate electrode as viewed in plane, and a region adjacent to the gate electrode and the source electrode and a region adjacent to the gate electrode and the drain electrode are, in a region where the at least one of the source electrode and the drain electrode does not overlap with the gate electrode, processed for resistance reduction in a region of the oxide semiconductor film including a surface thereof.
 2. The semiconductor device of claim 1, wherein sheet resistance in the region of the oxide semiconductor film where the resistance is reduced is 10 Ω/sq-100 kΩ/sq.
 3. The semiconductor device of claim 1, wherein the channel part has a channel width of equal to or less than 50 μm.
 4. The semiconductor device of claim 1, wherein the oxide semiconductor film is made of metal oxide containing at least one selected from a group consisting of indium (In), gallium (Ga), and zinc (Zn).
 5. The semiconductor device of claim 4, wherein the oxide semiconductor film is made of In—Ga—Zn—O metal oxide.
 6. A thin film transistor substrate, comprising: a thin film transistor provided on a substrate body, wherein the thin film transistor is the semiconductor device of claim
 1. 7. The thin film transistor substrate of claim 6, wherein the semiconductor device is provided at a last stage of a buffer circuit of a gate driver region.
 8. A display apparatus, comprising: the thin film transistor substrate of claim 6; a counter substrate arranged so as to face the thin film transistor substrate; and a display medium layer provided between the thin film transistor substrate and the counter substrate.
 9. The display apparatus of claim 8, wherein the display medium layer is a liquid crystal layer. 